| Образ | KEY Part # / Производитель | Описание / PDF | Количество / Запрос |
|---|---|---|---|
 |
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR GEN PURP. Thermal Interface Products Mica Insulator for DO-5 |
584873шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECT IC 14DIP 0.050. Heat Sinks Semiconductor Mounting Pad, Rectangular, Dialyl Phthalate (DAP), Integrated Circuits, 14-DIP, 19.05x11.43x1.28mm |
120362шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-11, 4 Leads, 1.91mm Thickness |
666106шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR GEN PURP. |
388377шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.180. |
790543шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-5, 3 Leads, 1.91mm Thickness |
808309шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.120. |
749369шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.125. |
773543шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.020. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 0.51x8.89mm |
355323шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Thermal Interface Products Semiconductor Mounting Pad for TO-18, Nylon, 4 Leads, 6.35mm OD, 0.97mm Thickness |
149298шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.070. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.78x9.27mm |
201206шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-18, Circular |
168400шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.046. |
719394шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. |
685138шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for Integrated Circuits, Nylon, 8 Leads, 12.70mm OD, 6.99mm Thickness |
100000шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRC GEN PURP 0.002. |
566452шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.130. |
201814шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.91x9.53x5.08mm |
92907шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.275. |
273774шт сток |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. |
266139шт сток |
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